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 What are the distinctive features of our vapor chamber technologies? |
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| With years of professional and research experience, our engineers have designed Vaportek, a vapour chamber that specifically deals with the shortcomings of the vapour chambers currently in the market. Vaportek utilizes a number of new patented and patented pending technologies which maximizes the heat dissipation function of vapour chamber, leading cooling technology into a new era. |
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| Principle of Vaportek |
| The heat dissipation principle of Vaportek can be best understood by using the analogy of the evaporation-rain cycle in tropical rain forests. The sun’s heat vaporizes the water on the ground and when the water vapour rises and encounters a cool front, clouds will form and subsequently becomes rain which is then returned to the earth’s surface. |
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| The above mentioned process can be summarized into four main steps; the steps of 1. Evaporation, and 4. Return are the decisive factors affecting the cooling effect. |
1. Evaporation
2.Vapor Flow
3.Condensation
4. Return |
| Vaportek technology improves the above mentioned step 1 (Evaporation) and 4 (Return) effectively. In these two critical steps, the Vapor Chamber’s cooling function is maximized. |
| Limitations of conventional Vapor Chambers |
| None of the Vapor Chamber products currently found in the market can provide a solution to the following two key issues: |
A) How to speedup the flow of coolant back to the thermal source, i.e., “(Step 4 “Return)”
B) How to increase the evaporation efficiency, i.e., Step 1 (Evaporation). |
| Therefore, Vapor Chambers using Vaportek technology have superior heat dissipation efficiency than conventional vapour chambers. |
| Patented technology |
| In view of this, our patented technology is aimed at addressing these two limitations of vapor chambers by utilizing the Multi-wick patent and the Boiling-Enhanced Multi-wick patents. |
| 1)Vapor Augmented Heatsink with Multi-Wick Structure |
The Multi-wick patents resulted from our R&D in 2001, when we hypothesized that the flow system in a vapor chamber must necessarily resemble that of a river tributary system whereby smaller streams feed into larger creeks which in turn flow into a larger river.
To enable this flow condition, we used what in our patent is called a “Multi-wick”, structure, which has the distinguishing features of possessing an increasing wicking power as the liquid gets closer to the evaporation region.
One of our patented methods to achieve this, is to create a gradation in the porosity of the wick material, for example by simply overlaying a finer mesh at the evaporation region of an otherwise coarse mesh wick structure.
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| (Condensate flowing back from the condensation region to the evaporation region and forms tributaries feature. Outside dotted circle is also part of condensing region.) |
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| 2) Vapor Chamber with Boiling-Enhanced Multi-Wick Structure |
| As a followup to the Multi-wick concept, we became aware of the need to improve the evaporation efficiency at the evaporation region. This gave rise to our second patent series, in which we utilized evaporation enhancement structures at the evaporation region to give rise to a sub-class of Multi-wick that we called Boiling-enhanced Multi-wick structures. These structures have the unique distinction of possessing an increase in surface evaporation area relative to the surrounding. One of our patented methods to achieve this includes, for example, the utilization of fins or mesh structures at the evaporation region. |
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| Absolute patent |
| As of December 2007, the Multi-wick and Boiling Enhanced Multi-wick total over 15 world-wide patents granted and pending. These are core level patents with protections ranging from methods, to specific formats, to a generic format with varying wicking power. It is through these protected innovations that the company was able to develop and offer industry-leading cooling solution to usher in a new era for the semiconductor industry. |
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