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 What is the advantage of vapor chambers? |
| Conventional heatsinks are usually made of highly conductive materials such as aluminum or copper and are commonly used owing to their reliability, low-cost and simplicity. In principle, the heatsink utilizes a conduction mechanism to transport the heat from a concentrated heatsource to its larger convecting surfaces where a moving fluid carries it away to the ambient. Due to product design constraints (volume, weight, total thermal resistance) heatsinks are difficult for successful adaptation in applications with high-end electronic applications. Therefore, electronic manufacturers have been searching for another more efficient solution that heatpipe and vapor chamber are introduced. |
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| Vapor Chamber make use of the latent heat of evaporation whereby the devices are sealed with a liquid inside, so that the heat is first absorbed from the source by the evaporating liquid and then transported through its vapor pressure to a condensing region where the heat is finally convected out to the ambient. Obviously, for continuous operation, the condensate needs to be transported back to the evaporation region, and for a heatpipe, this is accomplished through the capillary forces generated by the wicking structures that line its internal surfaces. |
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| Vapor Chamber offers distinct advantages over heatsinks and other most competing cooling technologies. |
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| • reduced thermal resistance |
| • larger cooling area to heating area ratio |
| • orientational independence |
| • leakage proof |
| • flexible shapes and configurations |
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| Due to its distinct advantages, Vapor Chamber is successful adaptation in applications with high heatflow and heatflux requirements (i.e., high-end electronic applications). For examples, Notebooks, graphic cards, blade severs. |